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Tin Plating
Tin Coatings are Used to Plate Components for:
- Engineering
- Military
- Communications
- Consumer product devices
The Tin provides a low contact-resistance surface, to protect against corrosion, to facilitate soldering and provides anti-galling properties.
On the Purchase Order, the Customer Must Reference to the Following Information:
- ASTM Specification and year of issue.
- Composition and metallurgical condition of the substrate.
- Service class (A, B, C, D, E)
- Underplating or substrate (if required)
ASTM-B-545 Standard Specification for Electrodeposited Coatings of Tin
Tin and tin/lead are deposited in many forms and from a number of different electrolytes. There is bright tin, matte tin, 90/10 tin/lead, 60/40 tin/lead, deposited from sulfate, fluoborate, ethane-sulfonic acid based solutions. Tin can also be plated from an alkaline stannate bath. Tin and its alloy are primarily plated for their solderability and electrical characteristics.
Class | Minimum Thickness | Typical Application |
|---|---|---|
A | 2.5 μm - 0.0001” | Electrical Contact (Not to be soldered) |
B | 5.0 μm - 0.0002” | For mild service conditions To facilitate Soldering |
C | 8.0 μm - 0.00031" 10 μm - .00039 for steel substrate | Electrical Hardware, Frames, Chassis |
D | 15 μm - 0.00059" 20 μm - .00078 for steel substrate | Electrical connectors for severe services, automotive accessories |
E | 30 μm - 0.00118" | Very severe conditions, high temperatures, abrasion and corrosive atmospheres or gases. |
| Barrel |
Most efficient method for finishing bulk parts and most often used for corrosion protection. Barrel plating is high efficiency, versatile and labor efficient process.
| Bright |
Bright deposits are very smooth and mirror like in appearance while matte deposits are flat and white to gray in color. Matte tin deposits have a very low included carbon content and tend to solder better than bright deposits which have a much higher included carbon in the deposit because of the organic additives that are used to provide a tighter grain structure.
| Matte/Dull |
Matte tin deposits have a very low included carbon content and tend to solder better than bright deposits which have a much higher included carbon in the deposit because of the organic additives that are used to provide a tighter grain structure.
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