The Tin provides a low contact-resistance surface, to protect against corrosion, to facilitate soldering and provides anti-galling properties.
Tin and tin/lead are deposited in many forms and from a number of different electrolytes. There is bright tin, matte tin, 90/10 tin/lead, 60/40 tin/lead, deposited from sulfate, fluoborate, ethane-sulfonic acid based solutions. Tin can also be plated from an alkaline stannate bath. Tin and its alloy are primarily plated for their solderability and electrical characteristics.
2.5 μm - 0.0001”
(Not to be soldered)
5.0 μm - 0.0002”
For mild service conditions
To facilitate Soldering
8.0 μm - 0.00031"
10 μm - .00039 for steel substrate
Electrical Hardware, Frames, Chassis
15 μm - 0.00059"
20 μm - .00078 for steel substrate
Electrical connectors for severe services, automotive accessories
30 μm - 0.00118"
Very severe conditions, high temperatures, abrasion and corrosive atmospheres or gases.
Most efficient method for finishing bulk parts and most often used for corrosion protection. Barrel plating is high efficiency, versatile and labor efficient process.
Bright deposits are very smooth and mirror like in appearance while matte deposits are flat and white to gray in color. Matte tin deposits have a very low included carbon content and tend to solder better than bright deposits which have a much higher included carbon in the deposit because of the organic additives that are used to provide a tighter grain structure.
Matte tin deposits have a very low included carbon content and tend to solder better than bright deposits which have a much higher included carbon in the deposit because of the organic additives that are used to provide a tighter grain structure.
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